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Electrical Engineering Department - College of Engineering

Background

The Department of Electrical Engineering at the University of Arkansas in Fayetteville was established in 1897.
Our EE program at the University of Arkansas has been offering BS degrees for over 100 years and has been continuously accredited since 1936. We were one of the first four programs in the nation to meet the ABET accreditation standards (criteria 2000) and we received good review in the 2002 visit (next visitation 2008). The Electrical Engineering curriculum consists of approximately 128 semester hours of coursework.  The program is divided into essentially three-phases with a great emphasis on design aspects; (1) The first year consists of a pre-professional curriculum, where electrical engineering students develop a sound understanding of basic science and mathematics, (2)  The second and third years coursework develops scientific principles and covers the basic core of the electrical engineering student’s professional curriculum, and (3)  The fourth year is composed primarily
of senior level elective courses.  This final year permits electrical engineering students to tailor and master a program suited for their specific individual career objectives.  The department also offers Master degrees (M.S.E.E., M.S.Tc.E., MSE) and Ph. D. degrees.  Enrollment is approximately 340 for 2003-2004 academic year, with 213 undergraduates, 104 M.S., and 44 Ph. D. students, including microEP graduate students. Enrollment is 361 for 2004-2005, with 213 undergraduates, 104 M.S., and 44 Ph.D. students (graduated 41 BSEE, 42 MSEE, 4 MS microEP, 13 PhDEE, and 3 PhD microEP in 2005).

A total of  19 FTE tenure and tenure track (12 Full Professors, 6 Associate Professors, and 1 Assistant Professors), 2 Visiting Professors, 1 Research Professor, 3 Associate Deans, and 21 Adjunct Faculty. The departmental faculty size is anticipated to grow 10% in the next academic year. Recent employers of University of Arkansas graduates include the following companies Alltel, Raytheon, Entergy, MCI World Com, Sprint, Lockheed Martin, HP, Texas Instruments, Entergy, SWEPCO, Arkansas Electric Cooperation, Hughes, BEI, Northrop-Grumman, Intel, Wal-Mart, Baldor, Andersen Consulting, Motorola, National Semiconductor, Dallas Semiconductor, Exxon, Dow, Whirlpool, and Integrated Device Technologies. 

To inquire about issues related to academic affairs, the undergraduate program, within the Department of Electrical Engineering, students are advised to contact the Department Head.

Teaching & Research Laboratories within Electrical Engineering

  • Computational EM Lab, Dr. Magda El-Shenawee

  • Optoelectronics Lab, Dr. O. Manasreh

  • Control Systems Lab, Dr. R. McCann & Dr T. Martin

  • Agile Motion Prototyping Lab, Dr. J. C.Balda

  • Mixed-Signal CAD Lab, Dr. A. Mantooth

  • Power Systems Lab, Dr. A. Mantooth

  • Solid State Lab, Dr. H. Naseem

  • Switch Mode Lab, Dr. S. Ang

  • Photovoltaics Lab, Dr. H. Naseem

  • Ceramic Electronics Packaging Lab

  • HiDEC faculty: Ang, W. D. Brown, Burkett, Manasreh, Mantooth, Naseem, Schaper, and Vijay Varadan

  • Research Centers within Electrical Engineering

    The Department has undergone a major curriculum restructuring at the graduate level in order to address issues related to mixed-signal systems, RF wireless telecommunications, networking, nanostructures, sensors, biomimetics, bioinformatics, imaging, and the electronic packaging needs of future electrical systems and components. These research areas are actively pursued: Sensors, Widebandgap Materials, Nano- & MEMS Technology, Biotechnology, High Temperature Devices & Systems, Wireless Communications, Wireless Networks, Multi-user Detection for Wireless Communications, Radar Medical Application for Breast Cancer Detection, Rough Surface Scattering and Radar Antennas, High Temperature Superconductor (HTSC), Integrated Passives, MCM Technology (Integrated Mesh Power System Topology, Power Electronics Packaging, Flip Chip, BGA, UBM, Seamless Off Chip Connectivity, and Substrates including Ceramic, Tape, Transfer Tape, and Flex), Thermal Management (Power Electronics Packaging, 3-D MCMs, Diamond Post Processing and Growth, and Simulation), Optical Interconnect, MicroElectroMechanical Systems (MEMs) Packaging and Fabrication, RF & Microwaves Simulation, Modeling & Measurements, High Performance Mixed-Signal Systems, Motor Drives, Electric Propulsion Applications, Development of Flexible Thin Film Solar Cells, and SiC Packaging.

    Research funding is on the order of $7.5 million/year with $3.89 million expenditures in FY 00, $11 million with $5.89 million expenditures in FY 01, $11.5 million with $6.5 million expenditures in FY 02, and $6,659,243 expenditures in FY 03 ($3,515,620 from Federal, $1,517,084.33 from NSF, $250,000 from NIH, and $330,000 from Industry). The department has the following four research centers:

    High Density Electronics Center (HiDEC) - http://www.hidec.uark.edu/

    A DARPA-funded Research Center since 1991

  • Center Director: Professor Vijay Varadan
  • Arkansas Advanced Photovoltaic Research Center (AAPRC)

    A Center funded by NASA

    • Center Director: Professor H. Naseem

    MicroElectronics-Photonics, Cooperative Electrical Engineering and Physics Program

    A Program funded by NSF

    • Program Director: Professor K. Vickers

    National Center for Advanced Power Electronics (NCAPA)

    A National Center for Reliable Electric Power Transmission

    • Center Director: Professor Alan Mantooth

    Graduate Programs in the Electrical Engineering Department

    To inquire about the above research areas and centers, as well as research opportunities within EE (graduate degree programs), application and admission policies, students are advised to contact Dr. Randy Brown, Graduate Committee Chair.

    Departmental Faculty and Areas of Expertise

  • Dr. Simon Ang (Professor), Mixed-Signal Testing, Microelectronics, MEMs, Power Electronics, and Electronic Packaging

  • Dr. Juan C. Balda (Professor), Power Electronics, Electric Machinery, Motion Control, and Electric Power Distribution Systems

  • Dr. Randy L. Brown (Associate Professor & Graduate Chair), Digital Electronics, CAD, and Integrated Circuit Design

  • Dr. William D. Brown, IEEE Fellow, ECS Fellow (Distinguished Professor), Microelectronics, Solid State Physics, and Electronic Packaging

  • Dr. Keith Burgers (Research Professor), Power Electronics

  • Dr. Susan Burkett (Professor), Microelectronics Materials and Electronic Packaging

  • Dr. Magda El-Shenawee (Associate Professor), Rough Surface Scattering, Computational Electromagnetics, and RF and Microwave Modeling

  • Dr. Jim L. Gattis (Associate Professor), Image Processing, Networking, and Interactive Graphics

  • Dr. Omar Manasreh (Professor), Optoelectronics Measurements and Semiconductor Nanostructures

  • Dr. H. Alan Mantooth (Professor), Analog & Mixed-Signal Circuit Design, and CAD

  • Dr. Terry W. Martin (Professor & Associate Dean), Control Systems

  • Dr. Roy McCann (Associate Professor), Control Systems

  • Dr. Hameed A. Naseem (Professor), Microelectronics, Solar Cells, Electronic Materials, and Electronic Packaging

  • Dr. Leonard W. Schaper, IEEE Fellow & IMAPS Fellow (Professor), Electronic Packaging, Passive Components

  • Dr. Scott Smith (Associate Professor), Computer & Digital Design, especially Asynchronous Logic

  • Dr. Kazem Sohraby (Professor), Computer Communications Networks, Next Generation Bio and Quantum Networks, and Wireless & Sensors Networks, Sohraby@uark.edu

  • Dr. Vasundara Varadan, SPIE Fellow, Distinguished Professor, & George and Boyce Billingsley Endowed Chair, Smart materials and structures

  • Dr. Vijay Varadan, SPIE Fellow, Distinguished Professor, HiDEC Director & Graduate arch Research Chair in Microelectronics and High Density Electronics, Sensors, MEMS, BioChips, Implantable Devices, Neuroelectronics, and Neurosurgery

  • Graduate Courses offered

    Networks Analysis & Synthesis; Semiconductor Devices; Solid State Electronics; Design and Fabrication of Solar Cells; Integrated Circuits Design; Integrated Circuit Fabrication Technology & Laboratory; Analog Integrated Circuits; Power Electronics; Electronics Manufacturing Processes; Advanced Packaging; Electromagnetic Transmission; Antennas, Radiation, and Propagation; Satellite Communication Systems; Advanced Electromagnetics Scattering and Transmission; Electric Power Quality; Power System Analysis; Power Distribution Systems; Power Electronics and Motor Drives; Modeling and Simulation of Mixed-Signal Circuits and Systems; Advanced Mixed-Signal Test Engineering; Mixed-Signal Microelectronics; Analog Integrated Circuits; Switch Mode Power Conversion; Analog & Digital Communications; Analog and Sampled-Data Filters; Digital Signal Processing; Digital Systems Design; Random Signal Analysis; DSP Digital Communications; Deterministic DSP System Design; Stochastic DSP System Design; Real-Time DSP Lab; Microprocessor System Design; Computer Hardware Organization; Computer Communication Networks; Control Systems; Adaptive Filtering & Control; Systems Theory; Stochastic Control Systems; Optimal Control Systems; Digital Control Systems; Nonlinear System Analysis and Control; Sensors & Remote Sensing; Image Processing & Speech Processing; Lightwave Communications; Non-Linear Optics; Spread Spectrum Communications; Introduction to Wireless Communications; Wireless Data; Chaotic Systems with Applications to Communications; Semiconductor Nanostructures I and II; Introduction to Telecommunications; and RF and Microwaves Design, Simulation, and Measurements Techniques.

    Structure Committees in Electrical Engineering (2004-2005)

  • Executive and Resources Committee
    Members: S. Ang, J. Balda, W. Brown, and A. Mantooth.

  • Tenure & Promotion Committee
    Members: S. Ang, J. Balda, S. Burkett, T. Martin, R. Brown, W. D. Brown, J. Gattis, H. Naseem, A. Mantooth, L. Schaper, Vasu Varadan, and Vijay Varadan.

  • Curriculum & ABET Review Committee
    Members: R. Brown, S. Burkett, M. El-Shenawee, and T. Martin.

  • Graduate Committee
    R. Brown, Chair. Members: S. Ang, O. Manasreh, A. Mantooth, R. McCann, H. Naseem, L. Schaper , and Vasu Varadan.

  • Computer/Laboratory Committee
    J. Balda, Chair. Members: G. Tatge.

  • Recruitment Committee
    Members: T. Carter, S. Burkett, A. Mantooth, and T. Martin.

  • Technical Area Committees in Electrical Engineering (2004-2005)

  • Mixed-Signal and Telecommunications Committee
    Mantooth, Chair, Members: S. Ang, J. Gattis, D. Thompson (CSCE), and B. Panda (CSCE).

  • Computers/Digital Hardware Committee
    R. Brown, Chair, Members: J. Gattis, P. Parkerson (CSCE), D. Thompson (CSCE), and P. Lala (CSCE).

  • Energy and Control Committee
    J. Balda, Chair. Members: A. Mantooth, T. Martin, M. El-Shenawee, R. McCann, and Vasu Varadan.

  • Electronics and Circuits Committee
    H. Naseem Chair. Members: S. Ang, R. Brown, W. Brown, S. Burkett, O. Manasreh, and L. Schaper.

  • Student Organizations

  • Eta Kappa Nu, Electrical Engineering Society
    Current President: Chris Sweeny. Faculty Advisor: Professor Alan Mantooth.

  • International Microelectronics and Packaging Society, IMAPS
    Current President: Jeremy Junghans. Faculty Advisor: Professor A. Elshabini.

  • The Institute of Electrical and Electronics Engineers, IEEE
    Current President: John Daily. Faculty Advisor: Professor J. C. Balda

  • The Institute of Electrical and Electronics Engineers, IEEE/CPMT
    Current President: Ryan Pooran. Faculty Advisor: Dr. Fred Barlow.

  • Solar Boat Team
    Faculty advisors; Professor Alan Mantooth & Professor Roy McCann.

  • Ham Radio Club (W5YM-L)
    Faculty Advisors: Dun Puckett and Professor J. C. Balda.

  • Tau Beta Pi
    Faculty Advisor: Dr. C. Caldwell, and Student President James Wigginton

  • University of Arkansas - Department of Electrical Engineering - 3217 Bell Engineering Center
    Fayetteville, AR 72701 - Phone: (479) 575-3009 - Fax: (479) 575-7967
    Copyright © 2004 University of Arkansas, College of Engineering. All Rights Reserved