Brown, William D.
Dr. William D. Brown
Distinguished Professor Emeritus
- B.S., Electrical Engineering, University of Arkansas
- M.S., Pennsylvania State University
- Ph.D., University of New Mexico
Teaching and Research
- Solid-state physics
- Electronic packaging
William D. Brown received the B.S. degree in Electrical Engineering from the University of Arkansas, Fayetteville, in 1969, the M.S. degree from Pennsylvania State University, University Park, in 1970; and the Ph.D. degree from the University of New Mexico, Albuquerque, in 1975.
From 1969 to 1977, he was a Member of the Technical Staff at Sandia National Laboratories in Albuquerque, NM. In 1977, he joined the faculty of the Electrical Engineering Department at the University of Arkansas where he presently holds the rank of Distinguished Professor Emeritus. He served as Head of the Department of Electrical Engineering from 1983 to 1998 and 2006 to 2007. He also served as the Associate Dean for Research in the College of Engineering from 1998 to 2007. His research interests include microelectronic materials and devices, solid state and semiconductor physics, and electronic packaging.
Bill is a registered Professional Engineer in the State of Arkansas and holds memberships in the Institute of Electrical and Electronics Engineers (IEEE), the Electrochemical Society (ECS), the International Microelectronics and Packaging Society (IMAPS), the American Society of Engineering Educators (ASEE) and the Arkansas Academy of Electrical Engineering (AAEE). He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE)and the Electrochemical Society (ECS). In 2009, Bill was honored as a Distinguished Alumnus of Captain Jack Joint Senior High School by the Mount Union Area Schools Alumni Association. In 2013, he was named a distinguished alumnus of the College of Engineering at the University of Arkansas. In May 2013, he was inducted into the National Academy of Inventors.
Bill’s research has resulted in over 350 conference presentations, over 300 technical journal/proceedings publications, and 12 U.S. patents. He has contributed to the book, Electronic Manufacturing Processes published by Prentice Hall, has contributed to and edited the books Nonvolatile Semiconductor Memory Technology and Advanced Electronic Packaging: With Emphasis On Multichip Modules, both published by the IEEE PRESS, and has contributed to and co-edited the book Advanced Electronic Packaging, 2nd edition, published by Wiley-Interscience/IEEE. He presently serves as an associate editor for the IEEE Transactions on Electronics Packaging Manufacturing.