Dr. Leonard Schaper
- B.S., Electrical Engineering, Newark College of Engineering
- M.S., Electrical Engineering, Massachusetts Institute of Technology
- Ph.D., New Jersey Institute of Technology
Teaching and Research
- Electronic packaging
- Integrated passive components
Biographical Information Leonard W. Schaper received his B.S. in Electrical Engineering at Newark College of Engineering in 1967, his S.M. in Electrical Engineering at the Massachusetts Institute of Technology in 1968, and the Doctorate in Engineering Science from New Jersey Institute of Technology in 1973. He taught both Electrical and Civil Engineering at NJIT before joining AT&T Bell Laboratories in 1978. There he held several positions in electronic power conversion, electronic technology planning, and technical management. He was one of the co-inventors of the early silicon substrate MCM-D development known as Advanced VLSI Packaging. In 1990, he joined Alcoa Electronic Packaging, where he led their thin-film MCM work, both in New Jersey and in Rancho Bernardo, CA. In 1992, he became Director of the High Density Electronics Center and Professor of Electrical Engineering at the University of Arkansas, where he led a research program in advanced interconnect technologies, including high temperature superconducting MCMs, diamond heat spreaders, mesh plane power distribution, MCM-D/L process development, integral passives, flex/thin silicon packaging, and ultra-low inductance decoupling capacitors. In 2002 he gave up his administrative responsibilities at HiDEC to concentrate full time on teaching and research. In 2003 he founded, with Chemical Engineering Professor Richard Ulrich, Xanodics, LLC, a company which will commercialize the integrated passive technologies developed at HiDEC. Dr. Schaper has been active in electronic packaging since 1980. He holds fifteen patents and has authored or co-authored over 250 talks and papers. He served for twelve years on the IEEE Computer Packaging Committee, on the International Electronics Packaging Society (IEPS) Board of Directors from 1990 to 1996, was President of the IEPS in 1996, and was instrumental in merging IEPS with ISHM to form IMAPS. He served as IMAPS Continuing Education Chair for 1997 - 1998, and was Technical Chair of the 1998 Denver MCM Conference. He serves on the Board of the IMAPS Educational Foundation, and served as IMAPS Technical Vice President for 1999 - 2001. He was an Associate Editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Advanced Packaging, from 1992 to 2000. He was a member of the IEEE CPMT Board of Governors from 1998 to 2001. Dr. Schaper is a Fellow of the IEEE and IMAPS, and is a member of Tau Beta Pi, Eta Kappa Nu, and Omicron Delta Kappa. He received an Outstanding Paper Award for his 1994 paper at the Electronic Components and Technology Conference, a Best Paper Award for his 1996 IEPS Symposium paper, and an Outstanding Paper Award for his 1997 MCM Conference paper. He was awarded the 1996 IEEE CPMT Society Outstanding Sustained Technical Contributions Award, for his “many accomplishments in the field of electronic packaging, particularly related to multichip modules.” In 2002 he was presented the William D. Ashman Award from IMAPS "for his contributions to electronic packaging in wire density analysis, MCM substrate technology, reduced-layer interconnect topology, integrated passive devices, and 3-D packaging."