Michael D. Glover
Research Associate
Electrical Engineering
Office: ENRC 373D
Phone: (479) 575-7292
Fax: (479) 575-2719
E-mail: mglover@uark.edu
Education
- B.S., Electrical Engineering, University of Arkansas
- M.S., Electrical Engineering, University of Arkansas
Teaching and Research
- Electronic Packaging
Biographical Information
Michael Glover graduated from the University of Arkansas with an M.S.E.E. in 1995. He became associated with the High Density Electronics Center (HiDEC) as a Research Assistant in July of 1993 and joined as a full-time staff member in January 1995. He is also pursuing a doctorate degree in Electrical Engineering at the University of Arkansas. Although his primary responsibilies originally included only the design of multichip modules and printed circuit boards, they were later expanded to include various managerial tasks within HiDEC. Recently, Michael's cross- training on thin-film fabrication has earned him a new role as instructor for a section of the Microcircuits Fabrication Class, one of several courses taught at HiDEC. This role as instructor is an extension of Michael's ever-present role as teacher and mentor to various students on the topic of design and mask generation. Over the past 10+ years, Michael has produced hundreds of mask designs for various HiDEC-related projects using Mentor Graphics' design tools and AutoCAD. These designs have ranged from simple single-layer design structures to ceramic/thinfilm hybrid packages with more than 40 artwork layers. Michael's experience in design, fabrication, and testing has also enabled him to act as an effective principal investigator for various externally funded projects. While acting in his various roles, Michael has written various custom software applications for internal use at HiDEC using C/C++, C#, Perl, PHP, Ruby, Lisp, Visual Basic, HTML, and SQL. Michael is a member of the Eta Kappa Nu engineering honor society and has also assisted the local IMAPS and CPMT student chapters with various activities. His general interests include computer architecture/programming, microelectronic packaging/fabrication, and digital systems.
